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RK3399 Android Motherboard Android Development Board SIM Card Phone Call Android 7.1 Board
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Clientop Technology Co., Ltd. (shenzhen)
15 yrs
CN
Key attributes
Industry-specific attributes
Base Material
FR-4
Board Thickness
1.6mm
Other attributes
Model Number
3399E
Place of Origin
Guangdong, China
Brand Name
Clientop
Copper Thickness
standard
Min. Hole Size
3.2mm
Min. Line Width
see specification
Min. Line Spacing
see specification
Surface Finishing
see specification
CPU
Rockchip RK3399 highest 64-bit high performance CPU, 2.0 GHz
Inner storage
2G/4G
Built-in memory
EMMC 16G(8G/32G/64G optional)
Max resolution
3840*2160
Decoding resolution
max to 4K
OS
Android 7.1
Interface
USB/TYPE C/Mipi Camera/RS232/485/GPS/3G 4G
Packaging and delivery
Packaging Details
pressure proof plastic bag and carton
Port
Hongkong/Shenzhen
Selling Units:
Single item
Single package size:
24X12X21 cm
Single gross weight:
1.000 kg
Supply Ability
Supply Ability
1000 Piece/Pieces per Month
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Lead time
Quantity (pieces)
1 - 1
2 - 10
11 - 50
> 50
Lead time (days)
3
4
7
To be negotiated
Minimum order quantity: 2 pieces
$100.00 - $120.00
Quantity
-
+
Shipping
Shipping solutions for the selected quantity are currently unavailable
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
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